Grinding, Laser and Dicing Service

This introduces the equipment that will be used for the Grinding, Laser and Dicing Service at the STAR UNION (Suzhou Site.)It is also possible to provide these services with machines that are not shown here.

Available Equipment
  • Grinder
    DAG810, DFG850, DFG8540, DFG8560, DGP8761
  • Laser
    DFL7160
  • Dicer
    DAD3230, DAD3350, DFD651, DFD6340, DFD6361
  • Related Equipment
    Laminator, Mounter, CO2 Bubbler,Diammaflow, Microscope, UV
Products
  • Size
    8 Inch以下
  • Products
    8英寸及以下各类硅片、PCB 基板、石英、玻璃、陶瓷等产品。 8英寸及以下超硬特殊材料的切割能力(如碳化硅,钽酸锂等)。
    ≤ 8 “wafer, PCB substrates, quartz, glass, ceramics, etc.

Delivery Flow

  • 01

    客户/思达优
    确认具体的规格和物料
  • 02

    客户
    制作订单
  • 03

    思达优
    确认加工程序
  • 04

    思达优
    开始加工
  • 05

    思达优
    检查品质
  • 06

    思达优
    发货
  • 07

    客户
    确认品质

contact us

If you have any questions or inquiries, please feel free to contact us

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Tel:
+86-189-6219-8497

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